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Jeremy A Theil, Ph.D.

jat

Principal and Founder

Dr. Theil is an expe­ri­enced tech­ni­cal leader who man­ages research and com­mer­cial­iza­tion pro­grams and devel­ops advanced mate­ri­als in the clean ener­gy and semi­con­duc­tor sec­tors. He is cur­rent­ly Senior Direc­tor of 3DIC Exter­nal Pro­grams for Inven­sas a divi­sion of Xperi Cor­po­ra­tion, focus­ing on zero-clear­ance hybrid bond­ing for 3D inte­grat­ed circuits.

In clean ener­gy tech­nolo­gies, he is an expert in process inte­gra­tion and devel­op­ment. He is an indus­try expert in thin-film pho­to­volta­ic mate­ri­als and suc­cess­ful­ly man­aged mul­ti­ple devel­op­ment pro­grams, at com­pa­nies such as First Solar and Alta Devices. Dr. Theil is rec­og­nized  as an expert in all pro­duc­tion-proven thin-film pho­to­volta­ic tech­nolo­gies (CdTe, CIGS, GaAs, and a‑Si:H).  He has spear­head­ed suc­cess­ful gov­ern­ment research, devel­op­ing mate­ri­als for record-break­ing effi­cien­cy solar cell tech­nol­o­gy. He devel­oped Quantumscape’s thin-film com­mer­cial­iza­tion strat­e­gy and sol­id-state elec­trolyte tech­nol­o­gy for high-den­si­ty and high-rate ener­gy stor­age, demon­strat­ing tech­ni­cal solu­tions to mul­ti­ple mis­sion crit­i­cal prob­lems. Addi­tion­al­ly, he has taught chem­i­cal engi­neer­ing for renew­able ener­gy at San Jose State University.

In the semi­con­duc­tor and sen­sor fields, he devel­oped advanced mate­ri­als and nov­el prod­ucts. At Hewlett-Packard Lab­o­ra­to­ries he worked on CMOS process inte­gra­tion and mate­ri­als devel­op­ment includ­ing advanced low‑κ mate­ri­als for advanced BEOL inter­con­nect. He also pio­neered a world-class pho­to­di­ode array tech­nol­o­gy for CMOS image sen­sors using α‑Si:H. In his role as in-house entre­pre­neur at Agi­lent Tech­nolo­gies, he took on a busi­ness devel­op­ment role for nov­el high­ly-inte­grat­ed and low-cost sen­sor con­cepts. He has also devel­oped process equip­ment for thin film appli­ca­tions such as sput­ter­ing, evap­o­ra­tion, and PECVD. At Philips-Lumileds, he high-effi­cien­cy III‑V light-emit­ting diode (LED) mate­r­i­al sys­tems, (AlIn­GaP and InGaN).

His edu­ca­tion includes a Ph.D. from North Car­oli­na State Uni­ver­si­ty in plas­ma chem­istry and sil­i­con-based mate­ri­als; a M.S. from the Uni­ver­si­ty of Illi­nois at Urbana-Cham­paign in sput­tered vana­di­um oxide films, both in Mate­ri­als Sci­ence and Engi­neer­ing; and a B.S. from Carnegie-Mel­lon Uni­ver­si­ty in Met­al­lur­gi­cal Engi­neer­ing. He authored 43 papers, includ­ing two review arti­cles, received 51 patents, and 12 patent appli­ca­tions. Pro­fes­sion­al­ly, he is an active mem­ber in sev­er­al soci­eties includ­ing the Mate­ri­als Research Soci­ety (MRS), and  Insti­tute of Elec­tri­cal and Elec­tron­ic Engi­neers (IEEE) where he is a Senior Mem­ber. Cur­rent­ly, he is Chair of the IEEE Sil­i­con Val­ley Sus­tain­abil­i­ty chap­ter, and Asso­ciate Edi­tor for Mate­ri­als for Ener­gy and Sus­tain­abil­i­ty at MRS Advances. In 2015, he was chair of the Spring Mate­ri­als Research Soci­ety Meet­ing in San Fran­cis­co. He is also a Senior Mem­ber of the Insti­tute of Elec­tri­cal and Elec­tron­ic Engi­neers (IEEE), and from 2015 until 2020 he has been trea­sur­er of the Sil­i­con Val­ley Pho­to­volta­ic Soci­ety (SVPVS). He was on the Tech­ni­cal Pro­gram Com­mit­tee for the 2017 and 2018 IWLPC (Inter­na­tion­al Wafer-Lev­el Pack­ag­ing Conferences).

See his per­son­al web­site at jtheil.com.