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Semiconductor

Selected Capabilities:

  • Yield Improve­ment
  • Process Inte­gra­tion
  • Process Flow Engineering
  • Fail­ure Analysis
  • Process Devel­op­ment
  • Tech­nol­o­gy Transfer
  • Spec­i­fi­ca­tion Drafting 
    • Process
    • Prod­uct
  • Design for Manufacturability

Selected Technologies:

  • Alu­minum- BEOL
  • Cop­per Dam­a­scene- BEOL
  • III‑V
  • II-VI
  • CMOS
  • 3D-IC
  • Wafer Bond­ing

Selected Processes:

  • Thin Film Deposition 
    • Chem­i­cal Vapor Deposition 
      • PECVD, RT-CVD
      • MOCVD
    • Phys­i­cal Vapor Depo­si­tion (PVD)
      • Sput­ter­ing, Evap­o­ra­tion, ALD
  • Inter­faces and Surfaces 
    • Sur­face Clean­ing and Processing
    • Surface/Interfacial Char­ac­ter­i­za­tion
  • Metrol­o­gy
    • Infrared/Raman Spec­troscopy
    • Ellip­som­e­try
    • In-situ Mea­sure­ments
    • Opto­elec­tron­ic Characterization
    • Elec­tri­cal Testing
    • XPS, AES, EDX, XRD, SEM
  • Ther­mal Processing
  • Etch (Dry and Wet)
  • Chem­i­cal Mechan­i­cal Polishing

We have exten­sive process devel­op­ment and process inte­gra­tion expe­ri­ence in CMOS and III‑V (nitride, phos­phide, and arsenide) tech­nolo­gies. We have deep expe­ri­ence scal­ing semi­con­duc­tor process­es into man­u­fac­tur­ing and resolv­ing all aspects of the ramp, includ­ing CMOS and III‑V opto­elec­tron­ic prod­ucts. We are also rec­og­nized experts with  cre­at­ing and inte­grat­ing new mate­ri­als into semi­con­duc­tor prod­ucts, and devel­op­ing and improv­ing process equip­ment giv­en our deep under­stand­ing of process/equipment depen­den­cies. We under­stand the chal­lenges posed by rapid growth, con­ver­gence and/or con­sol­i­da­tion, and help our clients turn these chal­lenges into oppor­tu­ni­ties for prof­itable growth. Our team has worked through numer­ous busi­ness chal­lenges and can help with your restruc­tur­ing, oper­a­tional improve­ment pro­gram, or orga­ni­za­tion­al realign­ment, so you can com­pete more effectively.

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Our expe­ri­ence ranges from bare wafer to test and pack­ag­ing for sev­er­al clients includ­ing Hewlett-Packard, Intel, and Agi­lent Tech­nolo­gies (now Ava­go). We have spear­head­ed nov­el sen­sor con­cepts to cre­ate high­ly-inte­grat­ed low-cost instru­men­ta­tion products.

We have devel­oped many mate­ri­als for advanced inte­grat­ed cir­cuit appli­ca­tions, includ­ing plas­ma-deposit­ed low-dielec­tric con­stant (low‑κ), deposit­ed semi­con­duc­tors, and trans­par­ent con­duc­tors. In each case, the result­ing mate­r­i­al and process flow was com­pat­i­ble with high-vol­ume CMOS fabrication.

With regards to III‑V mate­ri­als, we have suc­cess­ful­ly inte­grat­ed them into a vari­ety of opto­elec­tron­ic devices, includ­ing high-effi­cien­cy sol­id-state light­ing LEDs (Philips-Lumileds), and high effi­cien­cy solar cells (Alta Devices).